Material: Borosilicate Glass(PYREX Glass)

Silicon content>80%
Strain and Temperature520℃
Annealing temperature800℃
Index of refraction1.47
Transmittance≧90%
Elastic modulus E67KNmm-2
Tensile strength40-120Nmm-2
Processing temperature(104dpas)1220℃
Coefficient thermal expansion(20-300℃) (3.3±0.1)×10-6/K -1
Poisson's ratio μ0.2
Density(20℃)2.23g/cm3
Specific heat0.9Jg-1K-1
Thermal conductivity(20-100℃)1.2Wm-1K-1
Water resistance1 Level
Acid resistance1 Level
Alkali resistance2 Level
Contact Us